In the manufacturing of Type-C interfaces for mobile phones and computers, achieving the dual goals of “zero air bubbles” and “high efficiency” hinges on the
In today’s industrial adhesive application landscape, where “fast drying, high efficiency, and environmental friendliness” are becoming new trends, UV adhesives are widely used in electronics,
The core advantages of Second Intelligent lie in its high precision fluid control, robust proprietary technology barriers, mature industry solutions, and outstanding production line integration capabilities.
Achieving uniform and precise adhesive coating of sealing resin on connectors requires high-precision dispensing technology, equipment selection, and process optimization. This, combined with the connector’s
Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid
Dispensing and coating processes are widely used in manufacturing, while plasma cleaning serves as a critical pre-treatment step, significantly enhancing their quality and reliability. Plasma cleaning creates an
