Glue potting machine in the application of electronic packaging: how to avoid air bubbles, overflow glue and other common problems?
In the field of electronic packaging, the glue potting process directly affects the sealing, insulation and long-term reliability of the product. However, problems such as bubbles, glue overflow, and uneven glue amount often trouble production engineers, resulting in reduced yield and even product failure. This article will deeply analyze the common problems of the glue potting process and provide solutions such as vacuum degassing, precise metering, and process optimization to help you improve the quality and efficiency of glue potting.
1.The key role of glue potting in electronic packaging
Potting refers to potting liquid glue (such as epoxy resin, silicone, polyurethane, etc.) into specific areas of electronic components or PCB boards to achieve waterproof, shockproof, insulation, heat dissipation and other functions. Typical applications include:
- Power module potting (such as new energy vehicle electronic control unit)
- LED drive circuit packaging (moisture-proof and corrosion-proof)
- Sensor protection (such as industrial-grade temperature and humidity sensor)
- PCB board overall glue potting(anti-vibration, dust-proof)
However, if the glue potting machine process is not properly controlled, it is easy to have problems such as bubble residue, glue overflow, and poor curing, which will affect product performance.
Automatic Adhesive Potting Machines SEC-S3030-C
2.Analysis of the four common problems and causes of glue potting process
1.Bubble problem (affecting sealing and insulation)
Reasons:
a.The glue itself contains air (especially high-viscosity glue)
b.The glue pottingspeed is too fast and the glue cannot flow fully
c.No vacuum degassing treatment
2.Glue overflow problem (affecting appearance and assembly)
Reasons:
a.Imprecise glue quantity control (too much or too little)
b.Unreasonable glue dispensing path planning
c.The glue is too fluid (low-viscosity glue is easy to spread)
3.Uneven glue quantity (resulting in insufficient local protection)
Reasons:
a.Insufficient metering accuracy of glue pottingmachine
b.Changes in glue viscosity (affected by temperature or storage conditions)
c.Blockage or wear of dispensing valve
4.Poor curing (affecting mechanical strength)
Reasons:
a.Wrong mixing ratio (two-component glue)
b.Curing temperature/time does not meet the standard
c.Glue is expired or damp
3.Solution: How to optimize the glue pottingprocess?
1.Vacuum degassing technology (eliminating bubbles)
Method:
a.Vacuum degassing the glue before potting(vacuum pump evacuates for 5-10 minutes)
b.Use dynamic degassing system (degassing while potting)
Applicable scenarios: high viscosity glue (such as epoxy resin)
2.Accurate metering control (avoiding glue overflow/glue shortage)
Method:
a.Select a high-precision metering pump (gear pump or screw pump)
b.Use a closed-loop control system (real-time monitoring of glue volume and feedback adjustment)
c.Optimize the dispensing path (avoid overlap or glue leakage)
Glue dispensing potting machine SEC-S8700-E
3.Glue fluidity management (prevent glue overflow)
Methods:
a. Adjust glue viscosity (select appropriate glue model)
b.Use heating to reduce viscosity (suitable for low temperature environment)
c.Use cofferdams or baffles (limit the flow range of glue)
4.Automated glue pottingequipment (improve consistency)
Recommended solutions:
Desktop glue potting machine (suitable for small batches and high precision requirements)
Adhesive automatic glue potting system (suitable for mass production)
Visual positioning system (ensure accurate glue potting position)
Automatic In-Line Vacuum Glue Potting Machines Production Line
4.Case sharing: How to solve the problem of glue bubbles in LED driver modules?
Problem: When a certain LED manufacturer was encapsulating the driver module, it was found that there were tiny bubbles inside after curing, which affected the waterproof performance.
Solution:
1. Add a vacuum degassing step (vacuum the glue before encapsulation)
2.Optimize the glue pottingspeed (reduce the injection pressure to make the glue fill slowly)
3.Use low-viscosity silicone (reduce the risk of residual bubbles)
As a world-class precision dispenser manufacturer, Second Intelligent’s reliable, efficient glue dispensing and potting processes can significantly improve the performance, safety and service life of global electrical, electronics, home appliances, automotive electronics, telecom, pharmaceutical, semiconductor, aerospace, LED and more.
