Achieving uniform and precise adhesive coating of sealing resin on connectors requires high-precision dispensing technology, equipment selection, and process optimization. This, combined with the connector’s
Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid
Dispensing and coating processes are widely used in manufacturing, while plasma cleaning serves as a critical pre-treatment step, significantly enhancing their quality and reliability. Plasma cleaning creates an
As the core power device in power electronic equipment, the packaging reliability of IGBTs (Insulated Gate Bipolar Transistors) directly determines the lifespan and performance of
India’s industrial water purification market is experiencing explosive growth. The market size reached $$2.73 billion in 2025 and is projected to surge to$$4.35 billion by
Power batteries serve as the engine equivalent for gasoline vehicles and the primary power source for new energy vehicles. Power battery modules are assembled by
