Automotive Electronics Dispensing Solutions

Application of Fluid Dispensing Machines in the Semiconductor Component Field

Fluid dispensing machines are widely used in the semiconductor components industry due to their high precision and controlled fluid deposition capabilities, which are critical for multiple key processes in semiconductor manufacturing and packaging. Below are their primary applications and technical features:

1. Die Attach 、2. Underfill  3. Encapsulation

4. Solder Paste/Conductive Adhesive Dispensing

5. Temporary Bonding & Debonding

6. 3D Stacking & TSV Filling

7. Optical Component Assembly

Technical Advantages：

Industry Trends：Smart

1. Die Attach、2. Underfill 3. Encapsulation、4. Solder Paste/Conductive Adhesive Dispensing

5. Temporary Bonding & Debonding

6. 3D Stacking & TSV Filling 7. Optical Component Assembly