Features:
High stability –
Granite-casting machine base, makes the equipment structure more steady and stable. The parts and components are using good brand, which assures less wearing parts and fewer faults. It is designed and built for high precision and heavy-duty works.
Multi-function –
Machine installs with dual-X axis, dual-Y axis, and dual-Z axis robotic systems. One set in the front, and another set at the back. The back of the robot system can be installed with plasma treatment equipment, UV light, or 3D inspection camera to work with the dispensing machines in the front. For example, after a product was dispensed, the product being travel back to the other machine that carrying with UV light for immediately automatic cure.
Increase productivity –
With this machine, the left and right working desks work cyclically, saving loading and unloading time and increasing production capacity. The equipment can perform two functional applications at the same time, effectively reducing production time and increasing production capacity.
Machine
SEC-DP300 aims for high precision and high volume capacity productions. The machine applies with granite-casting robot base, makes the equipment structure more steady and stable. The parts and components are using good brand, which assures less wearing parts and fewer faults. The system also applying with linear-motor, it is designed and built for higher precision and heavy-duty works.


Material
SEC-DP300 is used in solder paste dispensing, semiconductor IC packaging, bottom filling and other processes.



MANUFACTURING
This machine is used in solder paste dispensing, semiconductor IC packaging, bottom filling and other processes.
With this steup, in one machine, it can provide multiple functions, such as plasma treatment before dispensing; or UV curing after dispensing. It is suitable for high capacity UPH production, one operator can handle two stations efficiently and effectively.


Dispensing process

Commonly used glue

Multi-valve picture display

Applications:
SEC-DP300 is used in solder paste dispensing, semiconductor IC packaging, bottom filling and other processes.
Dispensing Application
