Achievements of Second Intelligent Equipment in Dam Sealing Dispensing Applications Dam sealing dispensing is a high-precision dispensing technique used in electronic packaging and other industrial applications, primarily aimed at preventing liquid material leakage and providing structural support. Dam sealing dispensing involves applying adhesive in specific areas to create a fixed dam structure, which
Thermal Interface Materials (TIM) for Electronics/Electric Vehicle Dispensing Applications? Thermal interface materials are key materials for solving the heat dissipation bottleneck of modern electronic devices. Dispensing technology has become the mainstream process for TIM applications due to its high automation, high flexibility and suitability for complex shapes, especially in high-power, high-value fields such
What are the Applications of Solder Paste Dispensing Process in the SMT Industry? In general, solder paste dispensing is a selective, non-contact solder paste coating technology that complements and expands traditional stencil printing. Although stencil printing is the mainstream, dispensing offers irreplaceable advantages in many specific scenarios. Its main applications can be categorized
Second Intelligent attended NEPCON Thailand 2025 - the 23rd ASEAN International Electronics Manufacturing Assembly, Measurement and Testing Technology Exhibition Shenzhen Second Intelligent Equipment Co., Ltd. (Second Intelligent) sincerely invites you to visit our booth at the 23rd ASEAN International Electronics Manufacturing Assembly, Measurement and Test Technology Exhibition (NEPCON Thailand 2025) for guidance. Show Name: NEPCON Thailand 2025 Show Date: June 18-21, 2025 Address: Bangkok International Trade & Exhibition Center, Thailand (BITEC)
Creating Efficient Dispensing Solutions to Empower Industrial Production In modern industrial production, dispensing processes are an indispensable part of numerous manufacturing workflows. Whether it's the assembly of electronic products, the bonding of automotive components, or the production of other types of products, precise and efficient dispensing equipment is a key factor in ensuring
How to apply underfill adhesive dispensing to the bottom of chips on a PCB board? Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages). Below, I will explain the procedure in detail,
Deeply engaged in fluid application field! Second Intelligent will presents at 2025EeIE Smart Expo, Hall 13, Booth 13D001-1 waiting for you The 9th Shenzhen International Intelligent Equipment Industry Expo and the 12th Shenzhen International Electronic Equipment Industry Expo (2025EeIE) officially opened at the Shenzhen International Convention and Exhibition Center on August 27, 2025. Shenzhen Second Intelligent
SECOND Deepens Its Presence in Southeast Asia, Strengthening Partnerships for a Brighter Future For many years, SECOND has been dedicated to expanding in the Southeast Asian market, actively participating in well-known international exhibitions like Nepcon Thailand and Nepcon Vietnam. Through these events, we have gained valuable experience and market insights. As a result, SECOND has
Second Intelligent: The Premier Choice for Adhesive Dispensing Equipment, Empowering Manufacturing Advancement In today’s rapidly evolving manufacturing sector, adhesive dispensing equipment has become an essential tool across numerous industries. Whether it’s for the assembly of electronic products, the fixation of automotive parts, or the encapsulation of optical lenses, precise and efficient dispensing processes are
How can the yield rate of mobile phone frame structures be improved to over 99.9% by optimizing the dispensing solution? In the field of smartphone manufacturing, every detail is related to the final quality of the product and user experience. Among them, the sealing and stability of the mobile phone frame are one of the
