What are the applications of fluid dispensing machines in the field of semiconductor components?
Fluid dispensers are widely used and critical in the field of semiconductor components. They are mainly used for high-precision and high-reliability fluid dispensing to meet the requirements of miniaturization, complexity and high consistency in semiconductor manufacturing. The following are its main application scenarios and technical features:
1.Equipment parameter setting
1.Chip packaging
Underfill:
In flip chip packaging, the dispenser accurately injects epoxy resin glue into the gap between the chip and the substrate. After curing, it relieves thermal stress and improves mechanical strength and reliability.
SMT automatic glue dispenser SEC-DH600L
Second Intelligent high precision smt automatic glue dispenser machine apply epoxy resin to the bottom of the PCB board for underfill
Second Intelligent smt automatic glue dispenser automation SEC-DH600L has the following advantages:
● CCD visual programming precise positioning, visual correction, improve programming efficiency and dispensing accuracy;
● Chinese and English operating system, the software interface layout is clear, the operation is simple, easy to learn and understand;
● Support visual inspection, integrated control of dispensing and visual inspection, multi-purpose machine, effective control of dispensing yield;
● It can be equipped with a lin e laser scanner for 3D path guidance and flexible dispensing;
● The software can support a variety of dispensing systems and functional module applications, such as automatic needle alignment, automatic
height measurement, dispensing weighing compensation, five-axis linkage and other functions, which can effectively overcome the difficulties of
various dispensing processes and help improve quality;
Sealing and encapsulation:
The chip is sealed to protect it from moisture, dust and chemical corrosion. Commonly used materials include epoxy resin and silicone.
BGA/CSP packaging:
In ball grid array (BGA) or chip scale packaging (CSP), the dispenser is used to fill the gap around the solder ball or apply a protective layer.
2.Wafer-Level Packaging (WLP)
Wafer Bumping:
The solder or conductive adhesive is dispensed on the wafer by a dispensing machine to form interconnected bumps, replacing the traditional electroplating process.
Temporary Bonding Adhesive:
In thin wafer processing, the automatic glue dispensing machine applies temporary bonding adhesive to support the wafer for subsequent cutting and peeling.
Automatic In-line PCB Glue Dispensing Machine SEC-DH400L
Second Intelligent In-line Glue Dispensing Machine SEC-DH400L adopts an integrated mineral casting design, with ultra-high precision and super stability, powerful expansion capabilities, and can realize ion cleaning, dispensing, detection, UV exposure and other functions;
Adopting a gantry structure, it can bear large loads, stable structure, and a powerful CCD visual positioning system, which can meet the requirements of Mark point positioning, edge positioning, and 3D scanning positioning; strong scalability, and can expand AOI detection 3D detection, UV exposure curing and other functions;
Strong platform compatibility, contact and non-contact dispensing, single-head and multi-head synchronous dispensing, automatic compensation and adjustment of double-head spacing, five-axis dispensing function based on needle A/R displacement, etc.
3.Die Attach
Die Bonding:
The chip is fixed on the substrate or lead frame, using conductive adhesive (silver paste), insulating adhesive or thermal conductive adhesive (such as epoxy resin) to ensure electrical connection or heat dissipation.
4.3D Integration and Advanced Packaging
Through Silicon Via (TSV) Filling:
In 3D stacked packaging, the dispenser fills the insulating or conductive material in the silicon via to achieve vertical interconnection.
Interposer Processing:
It is used for interposer manufacturing of high-density interconnection, and accurately dispenses dielectric materials or adhesives.
5.Other Key Applications
Thermal Interface Material (TIM) Coating:
In power devices or CPU/GPU packaging, the dispenser coats thermal grease or phase change materials to optimize heat dissipation performance.
Local Photoresist Repair:
Locally repair the defective area of the wafer to reduce material waste in the photolithography process.
Technical Challenges and Requirements
Ultra-high Precision:
Semiconductor-level dispensing needs to achieve micron-level precision (such as glue line width below 0.1mm) to avoid overflow or insufficient coverage.
Material Compatibility:
It needs to adapt to a variety of functional materials such as conductive glue, epoxy resin, silicone, etc., and does not introduce bubbles or contaminants.
Process control:
The glue quantity, speed, and temperature must be strictly controllable (such as a constant temperature dispensing head) to ensure that there is no warping or delamination after curing.
Automation integration:
Linked with wafer probe stations, placement machines and other equipment to achieve fully automated production.
Industry trends
High-density packaging drive:
With the development of technologies such as 2.5D/3D packaging and Fan-Out, the dispensing process has evolved towards smaller sizes (such as less than 10μm) and multifunctional materials (such as nano silver paste).
Intelligent detection:
Combined with AI vision and real-time pressure feedback, closed-loop control of the dispensing process is achieved to improve yield.
In short, the fluid dispensing machine is one of the core equipment in semiconductor packaging and advanced processes, and its technological upgrade directly promotes the performance improvement and miniaturization of semiconductor components.
Second Intelligent has played an important role in theresearch, development, manufacturing, pre-sales and after-sales services of fluid dispensing robot, potting and coating solutions which range from various types of automatic fluid dispensing, potting, two-component potting machines and coating machines with desktop, free-standing, inline or cobot combined systems, and widely used in global electrical, electronics, home appliances, automobile, telecom, pharmaceutical, automotive electronics, semiconductor, aerospace, LED and more.
