This machine is suitable for UV-packaging, hot melt adhesive bonding, epoxy bottom filling (underfill) and other precision dispensing processes.
UV-underfill, red-bonding, epoxy adhesive precision standalone dispenser SEC-551B
Description
Features
High stability –
The machine is using a granite-casting seat, this is good material, it can keep up with very high precision and long term stable performance. The system is applying with quality brand parts and components for stability and low maintenance.
Flexibility –
The machine is flexible to add and adopt with different functions to fulfil different Materials, Products, and Production needs. The machine allow to add such as auto nozzle tilting rotation, automatic nozzle alignment, automatic height measurement, automatic weighing, automatic glue wiping, dual-valve synchronous/asynchronous and other functional modules.
Applications:
SEC-551B is frequently used in UV-packaging, hot melt adhesive bonding, epoxy bottom filling (underfill) and other precision dispensing processes.
Specification
Model | SEC-551B |
Dispensing range | X400*Y400*Z100mm |
Travel system | Servo-motor, lead-screw |
XY speed | Max:800mm/s |
Z speed | Max:200mm/s |
XYZ repeat accuracy | ±0.02mm |
Z-axis payload | 10kg |
Number of dispensing desk | 1 unit |
Dispensing desk size | 420mm*420mm |
Dispensing desk payload | Max:15Kg |
Ground to working height | 780±20mm |
CCD visual | High definition camera and lens(CCD) |
Visual light | LED red/blue/white |
Control system | Industrial computer, LCD monitor, mouse and keyboard |
Operating system | Windows 10 |
Dispensing software | Second Fluent |
Machine dimensions | W820*L1050*H1600mm |
Machine weight | 320kg (est.) |
Power supply | AC220V,50/60Hz,2Kw |
Air-pressure | 0.65MPa±0.02MPa,0.2m³/h |
Machine
This machine is suitable for UV-packaging, hot melt adhesive bonding, epoxy bottom filling (underfill) and other precision dispensing processes.


Material
It is able to dispense UV underfill, red bonding, solder paste, epoxy and other similar adhesives.



MANUFACTURING REF.
This machine is suitable for UV-packaging, hot melt adhesive bonding, epoxy bottom filling (underfill) and other precision dispensing processes.



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FAQ
We are direct manufacturer.
Generally, we pack our goods with proper wooden box. However, if client has special requirment, we can customize.
Depends on terms and conditions, negotiable.
Yes, we can produce according to the tested result. We can also product base on your design.
Yes, we will test 100% before delivery.
We keep good quality and competitive price to ensure our customers benefit. We respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.
Dispensing machine is an automatic machine and equipment that specializes in controlling fluid and dripping, coating, and potting the liquid on the surface of the product or inside the product. The glue dispenser is mainly used for glue and paint in the product process.
Glue dispensers are generally suitable for small products or electronic components, which are more precise; the products of potting dispensers are generally larger.
As long as it is a fluid with a viscosity within a certain range, it can be operated. The glue generally used in the dispenser includes red glue, hot melt glue, silica gel, grease and so on.
INQUIRY FORM