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  • automatic epoxy glue dispensing machine automation

    In-line 3 axis Stand-alone dispensing machine PCB pcba automatic epoxy glue dispensing machine automation for soldering paste

    Epoxy dispenser machine performance:
    CCD video-assisted programming, large field of view to take pictures as a whole, automatic identification of product location.

    Independently researched and developed R-axis needle head linkage rotation function, equipped with ceramic rotary valve, which is absolutely leading in the application field of conductive adhesive.

    Gantry dispensing platform can be equipped with a variety of glue supply systems to meet multi-process and realize one machine with multiple uses.

    The online dispenser can be flexibly equipped with automatic width adjustment, memory, weighing, code scanning, improve the information management level of the entire line of equipment.

  • Automated Mixing and Dispensing Machine_ UV adhesive dispensing machine

    High precision Automated PCB Silicon SEC-551B Automated Mixing and Glue Dispensing Machine screw uv epoxy silicone

    Adhesive Glueing System

    Floor-standing platform performance:

    ● CCD visual programming precise positioning, visual correction, improve programming efficiency and dispensing accuracy;
    ● Chinese and English operating system, clear software interface layout, simple operation, easy to learn and understand;
    ● Support visual inspection, integrated control of dispensing and visual inspection, one machine for multiple uses, effectively control dispensing yield;
    ● Can be equipped with a line laser scanner for 3D path guidance to achieve flexible dispensing;
    ● The software can support a variety of dispensing systems and functional module applications, such as automatic needle alignment, automatic height measurement, dispensing weighing compensation, five-axis linkage and other functions,
    effectively overcome the difficulties of various dispensing processes and help improve dispensing quality;

    This machine is suitable for UV-packaging, hot melt  adhesive dispensing robot  bonding, epoxy bottom filling (underfill) and other precision dispensing processes.

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