Machine:

SEC-DP200 machine is used frequently in silicone sealing, hot melt adhesive bonding, surface dispensing and mounting and other processes.

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Material 

It is able to dispense UV underfill, red bonding, solder paste, epoxy and other similar adhesives.

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MANUFACTURING

This machine is suitable for UV dispensing, hot melt adhesive bonding, epoxy dispensing machine and other adhesive material apply processes. The machine comes with 2 sets of robotic system installed front and back of the machine. With this steup, in one machine, it can provide multiple functions, such as plasma treatment before dispensing; or UV curing after dispensing. It is suitable for high capacity UPH production, one operator can handle two stations efficiently and effectively.

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